Rutronik Elektronische Bauelemente GmbH plans to broaden its business relationships in Asia and become better known in this growth market. To this end, Rutronik will be the main sponsor for Team HCB-Rutronik Racing from Wilferdingen at the FIA Grand Prix in Macau together with its partners Yageo and Vishay. The event will take place from… Read More


Ingenico Group, the global leader in seamless payment, announced that it has expanded its fraud detection and management capabilities with a new, real time solution that enables merchants to increase revenue by optimizing their acceptance rate and reduce customer churn. The new solution leverages sophisticated Artificial Intelligence (AI) technology developed by the German-Israeli payment security… Read More


Hong Kong, October 25, 2017 – HMD Global, the home of Nokia phones, today announced the launch of the Nokia 5 smartphone and the iconic Nokia 3310 3G, two different models to meet unique needs of users. Always striving to deliver the best possible smartphone experience, Nokia mobiles provides compelling experiences for consumers, and aim… Read More


Nina Xiang, Managing Editor and Founder of China Money Network Limited, the artificial intelligence (AI)-powered platform tracking China’s smart investments and technology innovation, today announced an important new addition to the company’s founding team. Naveet McMahon, will be joining CMN as managing partner and part of the company’s founding team, with effect from October 26,… Read More


Molex and Electronic Systems Technology, Inc. (EST) dba ESTeem Wireless Modems, manufacturer of the ESTeem#8482; product line of narrow-band licensed, Ethernet-licensed and unlicensed wireless modems, have signed a Master Goods Agreement that allows Molex to sell EST’s full product line as well as integrate ESTeem technology into Molex products. This distribution agreement expands the Molex… Read More


Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced its RTG4#8482; high-speed signal processing radiation-tolerant field programmable gate array (FPGA) engineering samples in a ceramic quad flat pack (CQFP) package are now available. The new CQ352 package, which conforms to the CQFP industry standard for space… Read More


Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the recent development of a breakthrough approach to protecting critical infrastructure against GPS spoofing and jamming threats with the introduction of its BlueSky#8482; GPS Firewall. Designed to provide security protection for GPS delivered position, navigation and timing… Read More


The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released an updated 3.0 Hardware specification for the new QSFP-DD form factor. In total, 62 companies came together in support of the QSFP-DD MSA to address the industry need for a high-density, high-speed networking solution. Established in March 2016, the… Read More


Engineers designing nRF51 and nRF52 Series Bluetooth Low Energy SoC applications now gain free access to SEGGER’s commercial Integrated Development Environment Ultra low power (ULP) RF specialist Nordic Semiconductor ASA announces it has signed an agreement with Hilden, Germany-based SEGGER Microcontroller GmbH Co. KG to license use of Embedded Studio. The agreement allows developers to… Read More


In addition to Bluetooth 5, nRF52810 SoC brings over-the-air (OTA) application updating, previously a feature of Nordic’s high-end nRF52 Series SoCs; an optimized Nordic S112 SoftDevice (RF protocol stack); and the latest Nordic nRF5 SDK that allows designers to get lower-cost, mass-market products to consumers with all the key benefits of the latest Bluetooth specification… Read More


Single port and dual port modules allow for fast charging in automotive and commercial vehicles. Molex has merged automotive-grade durability with mass availability on its line of USB Smart Charge Modules. Manufactured specifically for customers’ automotive and commercial vehicles that require a smart-charge USB module, Molex products feature state-of-the-art design to give users maximum performance.… Read More


Nordic’s nRF52840 System-on-Chip (SoC) with ‘Dynamic Multiprotocol’ feature uniquely supports concurrent Thread and Bluetooth 5 wireless connectivity (eliminating the need to disconnect from one network before connecting with another). This capability also ensures any Thread product based on the Nordic nRF52840 SoC and Nordic nRF5 SDK for Thread is seamlessly interoperable with Bluetooth 5 devices… Read More


Molex has added three new terminals plus the Mini50 sealed connector following the launch of its highly popular Mini50 Wire-to-Board Connector System. Designated as TAK50 terminal, CTX50 unsealed gold terminal, and CTX50 sealed terminal, these new terminals enable vehicle manufacturers to take advantage of miniaturized interconnect systems in both interior (unsealed) and exterior (sealed) applications.… Read More